Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
— The design trend towards CMPs has made the simulation of multiprocessor systems a necessity and has also made multiprocessor systems widely available. While a serial multiproce...
With the scaling of technology, transient errors caused by external particle strikes have become a critical challenge for microprocessor design. As embedded processors are widely ...
Abstract--Real-time stereo vision is attractive in many applications like robot navigation and 3D scene reconstruction. Data parallel platforms, e.g. GPU, is often used for real-ti...
Wei Yu, Tsuhan Chen, Franz Franchetti, James C. Ho...
Recent years have witnessed incredible popularity and adoption of smartphones and mobile devices, which is accompanied by large amount and wide variety of feature-rich smartphone ...