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DAC
2006
ACM
16 years 6 months ago
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
ISPASS
2007
IEEE
16 years 1 days ago
A Comparison of Two Approaches to Parallel Simulation of Multiprocessors
— The design trend towards CMPs has made the simulation of multiprocessor systems a necessity and has also made multiprocessor systems widely available. While a serial multiproce...
Andrew Over, Bill Clarke, Peter E. Strazdins
EMSOFT
2005
Springer
15 years 11 months ago
Compiler-guided register reliability improvement against soft errors
With the scaling of technology, transient errors caused by external particle strikes have become a critical challenge for microprocessor design. As embedded processors are widely ...
Jun Yan, Wei Zhang
TCSV
2010
15 years 14 days ago
High Performance Stereo Vision Designed for Massively Data Parallel Platforms
Abstract--Real-time stereo vision is attractive in many applications like robot navigation and 3D scene reconstruction. Data parallel platforms, e.g. GPU, is often used for real-ti...
Wei Yu, Tsuhan Chen, Franz Franchetti, James C. Ho...
CODASPY
2012
14 years 1 months ago
Detecting repackaged smartphone applications in third-party android marketplaces
Recent years have witnessed incredible popularity and adoption of smartphones and mobile devices, which is accompanied by large amount and wide variety of feature-rich smartphone ...
Wu Zhou, Yajin Zhou, Xuxian Jiang, Peng Ning