As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Aligning structures, often referred to as docking or registration, is frequently required in fields such as computer science, robotics and structural biology. The task of alignin...
Johannes Jansen van Vuuren, Michelle Kuttel, James...
Abstract. This paper introduces ThreadMill - a distributed and parallel component architecture for applications that process large volumes of streamed (time-sequenced) data, such a...
Gene expression profiles with clinical outcome data enable monitoring of disease progression and prediction of patient survival at the molecular level. We present a new computatio...
Abstract. We discuss a case study for the hospital scenario where workflow model components are distributed across various computers or devices (e.g. mobile phones, PDAs, sensors, ...