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SLIP
2009
ACM
16 years 23 days ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ICDCS
2007
IEEE
16 years 18 days ago
Overlay Node Placement: Analysis, Algorithms and Impact on Applications
Abstract— Overlay routing has emerged as a promising approach to improving performance and reliability of Internet paths. To fully realize the potential of overlay routing under ...
Sabyasachi Roy, Himabindu Pucha, Zheng Zhang, Y. C...
147
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ICPADS
2007
IEEE
16 years 18 days ago
A semantic overlay network for unstructured peer-to-peer protocols
Peer-to-Peer computing has become a popular networking paradigm for file sharing, distributed computing, collaborative working, etc. The widely used unstructured Peer-to-Peer pro...
Junfeng Xie, Zhenhua Li, Guihai Chen
CCGRID
2006
IEEE
16 years 10 days ago
QoS Oriented Resource Reservation in Shared Environments
Resource sharing across different computers and organizations makes it possible to support diverse, dynamic changing resource requirements of distributed applications. Reservation...
Ming Wu, Xian-He Sun, Yong Chen
CCGRID
2005
IEEE
15 years 12 months ago
User group-based workload analysis and modelling
Knowledge about the workload is an important aspect for scheduling of resources as parallel computers or Grid components. As the scheduling quality highly depends on the character...
Baiyi Song, Carsten Ernemann, Ramin Yahyapour