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75
Voted
ICCAD
2005
IEEE
15 years 6 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
DFT
2006
IEEE
15 years 3 months ago
2006
IEEE
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...
92
Voted
SIGMOD
2012
ACM
12 years 12 months ago
2012
ACM
Query substitution is an important problem in information retrieval. Much work focuses on how to find substitutes for any given query. In this paper, we study how to efficiently ...
CORR
2011
Springer
14 years 1 months ago
2011
Springer
Wireless systems comprised of rechargeable nodes have a significantly prolonged lifetime and are sustainable. A distinct characteristic of these systems is the fact that the node...
CIAC
2003
Springer
15 years 2 months ago
2003
Springer
Abstract. We consider problems of (new) station placement along (existing) railway tracks, so as to increase the number of users. We prove that, in spite of the NP-hardness for the...