Design Constraints imposed by global interconnect delays as well as limitations in integration of disparate technologies make 3-D chip stacks an enticing technology solution for m...
Awet Yemane Weldezion, Matt Grange, Dinesh Pamunuw...
DRAM power and energy efficiency considerations are becoming increasingly important for low-power and mobile systems. Using lower power modes provided by commodity DRAM chips redu...
We present a new approach for modeling and rendering existing architectural scenes from a sparse set of still photographs. Our modeling approach, which combines both geometry-base...
Paul E. Debevec, Camillo J. Taylor, Jitendra Malik
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...
Today's feature-rich multimedia products require embedded system solution with complex System-on-Chip (SoC) to meet market expectations of high performance at a low cost and l...
T. S. Rajesh Kumar, C. P. Ravikumar, R. Govindaraj...