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CODES
2007
IEEE
15 years 4 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
COMSWARE
2007
IEEE
15 years 4 months ago
Leveraging MAC-layer information for single-hop wireless transport in the Cache and Forward Architecture of the Future Internet
— Cache and Forward (CNF) Architecture is a novel architecture aimed at delivering content efficiently to potentially large number of intermittently connected mobile hosts. It us...
Sumathi Gopal, Sanjoy Paul, Dipankar Raychaudhuri
HICSS
2007
IEEE
156views Biometrics» more  HICSS 2007»
15 years 4 months ago
KnowFlow - A Hybrid Approach to Identifying and Visualizing Distributed Knowledge Work Practices
Understanding collaborative work practices represents a critical factor in and a necessary fundament for the development of effective Computer Supported Collaborative Work (CSCW) ...
Markus Strohmaier, Stefanie N. Lindstaedt
107
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HPDC
2007
IEEE
15 years 4 months ago
A fast topology inference: a building block for network-aware parallel processing
Adapting to the network is the key to achieving high performance for communication-intensive applications, including scientific computing, data intensive computing, and multicast...
Tatsuya Shirai, Hideo Saito, Kenjiro Taura
HPDC
2007
IEEE
15 years 4 months ago
A statistical approach to risk mitigation in computational markets
We study stochastic models to mitigate the risk of poor Quality-of-Service (QoS) in computational markets. Consumers who purchase services expect both price and performance guaran...
Thomas Sandholm, Kevin Lai