A new paradigm is introduced for floorplanning any combination of fixed-shape and variable-shape blocks under tight fixedoutline area constraints and a wirelength objective. Dra...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
- Many high-level description languages, such as C/C++ or Java, lack the capability to specify the bitwidth information for variables and operations. Synthesis from these specifica...
Jason Cong, Yiping Fan, Guoling Han, Yizhou Lin, J...
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
— Sub-resolution assist features (SRAFs) provide an absolutely essential technique for critical dimension (CD) control and process window enhancement in subwavelength lithography...