2487 search results - page 493 / 498 » cases 2009 |
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
ICCV
2009
IEEE
14 years 7 months ago
2009
IEEE
This work considers the problem of estimating the epipolar geometry between two cameras without needing a prespecified set of correspondences. It is capable of resolving the epipo...
113
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ICCV
2009
IEEE
14 years 7 months ago
2009
IEEE
Dense 3D reconstruction of extremely fast moving objects could contribute to various applications such as body structure analysis and accident avoidance and so on. The actual case...
100
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ICIP
2009
IEEE
14 years 7 months ago
2009
IEEE
Leading compressed sensing (CS) methods require m = O (k log(n)) compressive samples to perfectly reconstruct a k-sparse signal x of size n using random projection matrices (e.g., ...
ICISC
2009
14 years 7 months ago
2009
Abstract. The design of embedded processors demands a careful tradeoff between many conflicting objectives such as performance, silicon area and power consumption. Finding such a t...