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DATE
2006
IEEE
84views Hardware» more  DATE 2006»
15 years 9 months ago
Vulnerability analysis of L2 cache elements to single event upsets
Memory elements are the most vulnerable system component to soft errors. Since memory elements in cache arrays consume a large fraction of the die in modern microprocessors, the p...
Hossein Asadi, Vilas Sridharan, Mehdi Baradaran Ta...
DATE
2006
IEEE
122views Hardware» more  DATE 2006»
15 years 9 months ago
Power analysis of mobile 3D graphics
— The world of 3D graphics, until recently restricted to high-end workstations and game consoles, is rapidly expanding into the domain of mobile platforms such as cellular phones...
Bren Mochocki, Kanishka Lahiri, Srihari Cadambi
DATE
2006
IEEE
123views Hardware» more  DATE 2006»
15 years 9 months ago
Networks on chips for high-end consumer-electronics TV system architectures
Consumer electronics products, such as high-end (digital) TVs, contain complex systems on chip (SOC) that offer high computational performance at low cost. Traditionally, these SO...
Frits Steenhof, Harry Duque, Björn Nilsson, K...
DATE
2006
IEEE
152views Hardware» more  DATE 2006»
15 years 9 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
DFT
2006
IEEE
105views VLSI» more  DFT 2006»
15 years 9 months ago
Thermal-Aware SoC Test Scheduling with Test Set Partitioning and Interleaving
1 High temperature has become a major problem for system-on-chip testing. In order to reduce the test time while keeping the temperature of the chip under test within a safe range,...
Zhiyuan He, Zebo Peng, Petru Eles, Paul M. Rosinge...
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