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ICCAD
2010
IEEE
14 years 9 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
ICRA
2010
IEEE
14 years 9 months ago
2010
IEEE
The topic of reusable software in robotics is now largely addressed. Components based architectures, where components are independent units that can be reused accross applications,...
SG
2010
Springer
14 years 9 months ago
2010
Springer
Abstract. In this paper we present a novel approach to visualize irregularly occurring events. We introduce the event line view designed specifically for such events data (a subset...
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TSD
2010
Springer
14 years 9 months ago
2010
Springer
The question how to integrate information from different sources in speech decoding is still only partially solved (layered architecture versus integrated search). We investigate t...
CORR
2010
Springer
14 years 8 months ago
2010
Springer
In many applications involving multi-media data, the definition of similarity between items is integral to several key tasks, including nearest-neighbor retrieval, classification,...