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MR
2006
73views Robotics» more  MR 2006»
14 years 11 months ago
Reliability of large periphery GaN-on-Si HFETs
S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
MR
2007
93views Robotics» more  MR 2007»
14 years 11 months ago
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
The development of a simplified analytical model to describe the thermal history of a Printed Circuit Board assembly (PCA) during convective reflow soldering is described in this ...
Nele Van Steenberge, Paresh Limaye, Geert Willems,...
MR
2007
107views Robotics» more  MR 2007»
14 years 11 months ago
Cohesive zone modeling for structural integrity analysis of IC interconnects
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
B. A. E. van Hal, R. H. J. Peerlings, M. G. D. Gee...