This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Stochastic device noise has become a significant challenge for high-precision analog/RF circuits, and it is particularly difficult to correctly include both white noise and flic...
A three-dimensional (3D) CMOS imager constructed from stacking a pixel array of image sensors, an analog-to-digital converter (ADC) array, and an image signal processor (ISP) arra...
SRAM design has been a major challenge for nanoscale manufacturing technology. We propose a new bit cell repair scheme for designing maximum-information memory system (MIMS). Unli...
The Kahn Process Network (KPN) model is a widely used modelof-computation to specify and map streaming applications onto multiprocessor systems-on-chips. In general, KPNs are dif...
Using device write buffers is a promising technique to improve the write performance of solid-state disks. The write buffer not only reduces the write traffic to the flash but als...
Memory consistency litmus tests are small parallel programs that are designed to illustrate subtle differences between memory consistency models by exhibiting different outcomes...
DVFS remains an important energy management technique for embedded systems. However, its negative impact on transient fault rates has been recently shown. In this paper, we propos...
We present ChronOS Linux, a best-effort real-time Linux kernel for chip multiprocessors (CMPs). ChronOS addresses the intersection of three problem spaces: a) OS-support for obta...
Matthew Dellinger, Piyush Garyali, Binoy Ravindran