The deployment of computer vision algorithms in mobile applications is growing at a rapid pace. A primary component of the computer vision software pipeline is feature extraction,...
Jason Clemons, Andrew Jones, Robert Perricone, Sil...
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
Modern processor architectures call for software that is highly tuned to an unpredictable operating environment. Processlevel virtualization systems allow existing software to ada...
SystemC is a popular modeling language which can be used to specify systems at bstraction level. Currently, SystemC tools can not cope with SystemC models for which the module hie...
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
In this paper, a new sparse approximation technique is proposed for incremental power grid analysis. Our proposed method is motivated by the observation that when a power grid net...
Today’s multiprocessor system-on-a-chip (MPSoC) products typically have multiple execution modes, and for each mode, all the products utilize the same task allocation and schedu...
This paper presents a simulation toolset for estimating the impact of Trusted Platform Modules (TPMs) on the performance of applications that use TPM services, especially in multi...
Jared Schmitz, Jason Loew, Jesse Elwell, Dmitry Po...