Sciweavers
Explore
Publications
Books
Software
Tutorials
Presentations
Lectures Notes
Datasets
Labs
Conferences
Community
Upcoming
Conferences
Top Ranked Papers
Most Viewed Conferences
Conferences by Acronym
Conferences by Subject
Conferences by Year
Tools
PDF Tools
Image Tools
Text Tools
OCR Tools
Symbol and Emoji Tools
On-screen Keyboard
Latex Math Equation to Image
Smart IPA Phonetic Keyboard
Community
Sciweavers
About
Terms of Use
Privacy Policy
Cookies
87
click to vote
ISQED
2005
IEEE
76
views
Hardware
»
more
ISQED 2005
»
Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers
15 years 8 months ago
Download
vlsi.cse.yzu.edu.tw
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
Meng-Chiou Wu, Rung-Bin Lin
claim paper
Read More »