Reticle Floorplanning and Wafer Dicing for Multiple Project Wafers

Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simultaneous reticle floorplanning and wafer dicing problem, a formulation for rectile floorplanning problem which either deals with a pre-selected reticle size or incorporates reticle size optimization into a floorplanning process, and two ILP models and a simulated annealing implementation for wafer dicing. Production volume requirement and chip replication are considered in reticle floorplanning to enhance dicing yield. Although our methods take longer time to produce a floorplan, the floorplan results in better dicing yield than that obtained by previous work.

• Type: Conference
• Year: 2005
• Where: ISQED
• Authors: Meng-Chiou Wu, Rung-Bin Lin
• Keywords: Dicing Yield, Hardware, ISQED 2005, Wafer Dicing, Wafer Dicing Problem