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124

MR
2011

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Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process

14 years 9 months ago

Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process

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Yi-Hsin Weng, Hui-Wen Tsai, Ming-Dou Ker

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207

MR
2011

351views Robotics» more MR 2011»

Nickel-palladium bond pads for copper wire bonding

14 years 9 months ago

Nickel-palladium bond pads for copper wire bonding

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Horst Clauberg, Petra Backus, Bob Chylak

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