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143
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ASPLOS
2004
ACM
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ASPLOS 2004
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Heat-and-run: leveraging SMT and CMP to manage power density through the operating system
15 years 8 months ago
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cobweb.ecn.purdue.edu
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
Mohamed A. Gomaa, Michael D. Powell, T. N. Vijayku...
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