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DAC
2000
ACM
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Computer Architecture
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DAC 2000
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Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability
15 years 7 months ago
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dropzone.tamu.edu
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
Ruiqi Tian, D. F. Wong, Robert Boone
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