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ASPDAC
2008
ACM
122views Hardware» more  ASPDAC 2008»
13 years 8 months ago
LP based white space redistribution for thermal via planning and performance optimization in 3D ICs
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Xin Li, Yuchun Ma, Xianlong Hong, Sheqin Dong, Jas...
ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 1 days ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar