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    ICCAD
    2006
    IEEE
    124views Hardware» more  ICCAD 2006»
    Simultaneous power and thermal integrity driven via stapling in 3D ICs
    15 years 10 months ago
    Simultaneous power and thermal integrity driven via stapling in 3D ICs
    Download  eda.ee.ucla.edu
    The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
    Hao Yu, Joanna Ho, Lei He
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