TEM-cell and surface scan to identify the electromagnetic emission of integrated circuits

The characterization as well as the control of the electromagnetic emission of integrated circuits is an important step in the design process of state of the art integrated circuits. In the present paper we describe the use of the TEM-cell and the surface scan method according to a standard from the IEC as well as a combined version of these two methods. We present how these methods could be used in the characterization of test chips. We also present how the combined method was used to reduce the electromagnetic emission of a state of the art integrated circuit for automotive applications. Categories and Subject Descriptors B.7.2 [Integrated Circuits]: Design Aids; B.8.1 [Hardware]: Reliability, Testing and Fault-Tolerance General Terms Measurement, Performance, Design, Reliability, Standardization Keywords Electromagnetic emission (EME), TEM-Cell method, surface scan method

• Type: Conference
• Year: 2003
• Where: GLVLSI
• Authors: Timm Ostermann, Bernd Deutschmann
• Keywords: Art Integrated Circuit, Electromagnetic Emission, GLVLSI 2003, Integrated Circuits, VLSI