Sciweavers

Free Online Productivity Tools i2Speak i2Symbol i2OCR iTex2Img iWeb2Print iWeb2Shot i2Type iPdf2Split iPdf2Merge i2Bopomofo i2Arabic i2Style i2Image i2PDF iLatex2Rtf Sci2ools

9

CORR
2008
Springer

favoriteEmaildiscussreport

94views Education» more CORR 2008»

Through Silicon Vias as Enablers for 3D Systems

13 years 4 months ago

Through Silicon Vias as Enablers for 3D Systems

Download documents.irevues.inist.fr

This special session on 3D TSV

E. Jung, Andreas Ostmann, Peter Ramm, Jürgen

Real-time Traffic

Active Circuit | CORR 2008 | Education | Potential Implementation Solutions | Special Session |

claim paper

Related Content

» Through Silicon ViaBased Grid for Thermal Control in 3D Chips

» Fine grain 3D integration for microarchitecture design through cube packing exploration

» Systemlevel powerperformance evaluation of 3D stacked DRAMs for mobile applications

» Power distribution paths in 3D ICS

» Reliability aware through silicon via planning for 3D stacked ICs

» Compact modelling of ThroughSilicon Vias TSVs in threedimensional 3D integrated circuits

» A study of ThroughSiliconVia impact on the 3D stacked IC layout

» 3Dintegration of silicon devices A key technology for sophisticated products

» Design and feasibility of multiGbs quasiserial vertical interconnects based on TSVs for 3D...

Post Info
More Details (n/a)

Added	09 Dec 2010
Updated	09 Dec 2010
Type	Journal
Year	2008
Where	CORR
Authors	E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer

Comments (0)