24 search results - page 1 / 5 » A low-radix and low-diameter 3D interconnection network desi... |
TCAD
2010
12 years 11 months ago
2010
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
GLVLSI
2009
IEEE
13 years 2 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
SLIP
2005
ACM
13 years 10 months ago
2005
ACM
The interconnection architecture of FPGAs such as switches dominates performance of FPGAs. Three-dimensional integration of FPGAs overcomes interconnect limitations by allowing in...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...