19 search results - page 2 / 4 » A robust detailed placement for mixed-size IC designs |
ISPD
2005
ACM
13 years 11 months ago
2005
ACM
We streamline and extend APlace, the general analytic placement engine based on ideas of Naylor et al. [7] and described in [3, 4, 5]. Previous work explored the adaptability of A...
ISPD
2006
ACM
13 years 11 months ago
2006
ACM
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ICCAD
2005
IEEE
14 years 2 months ago
2005
IEEE
A novel and very simple correct-by-construction top-down methodology for high-utilization mixed-size placement is presented. The PolarBear algorithm combines recursive cutsize-dri...
FPL
2006
Springer
13 years 9 months ago
2006
Springer
Both custom IC and FPGA designs in the nanometer regime suffer from process variations. But different from custom ICs, FPGAs' programmability offers a unique design freedom t...