47 search results - page 2 / 10 » Assignment Stack Shrinking |
VLSID
2010
IEEE
13 years 3 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
ASPDAC
2005
ACM
13 years 7 months ago
2005
ACM
— This paper presents a multiple-voltage high-level synthesis methodology for low power DSP applications using algorithmic transformation techniques. Our approach is motivated by...
SLIP
2009
ACM
13 years 11 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
GCB
2006
Springer
13 years 9 months ago
2006
Springer
Abstract: The production of commercial DNA microarrays is based on a light-directed chemical synthesis driven by a set of masks or micromirror arrays. Because of the natural proper...
TVLSI
2010
12 years 12 months ago
2010
With the shrinking of technology feature sizes, the share of leakage in total power consumption of digital systems continues to grow. Traditional dynamic voltage scaling (DVS) fail...