Sciweavers

36 search results - page 6 / 8
» Can multipath mitigate power law delays
Sort
View
ISVLSI
2003
IEEE
91views VLSI» more  ISVLSI 2003»
13 years 11 months ago
Three-Dimensional Integrated Circuits: Performance, Design Methodology, and CAD Tools
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
Shamik Das, Anantha Chandrakasan, Rafael Reif
ISQED
2010
IEEE
156views Hardware» more  ISQED 2010»
13 years 7 months ago
On the design of different concurrent EDC schemes for S-Box and GF(p)
Recent studies have shown that an attacker can retrieve confidential information from cryptographic hardware (e.g. the secret key) by introducing internal faults. A secure and re...
Jimson Mathew, Hafizur Rahaman, Abusaleh M. Jabir,...
ISCA
2002
IEEE
91views Hardware» more  ISCA 2002»
13 years 10 months ago
Slack: Maximizing Performance Under Technological Constraints
Many emerging processor microarchitectures seek to manage technological constraints (e.g., wire delay, power, and circuit complexity) by resorting to nonuniform designs that provi...
Brian A. Fields, Rastislav Bodík, Mark D. H...
ISCA
2009
IEEE
152views Hardware» more  ISCA 2009»
14 years 13 days ago
Scaling the bandwidth wall: challenges in and avenues for CMP scaling
As transistor density continues to grow at an exponential rate in accordance to Moore’s law, the goal for many Chip Multi-Processor (CMP) systems is to scale the number of on-ch...
Brian M. Rogers, Anil Krishna, Gordon B. Bell, Ken...
INFOCOM
2010
IEEE
13 years 4 months ago
Recognizing Exponential Inter-Contact Time in VANETs
—Inter-contact time between moving vehicles is one of the key metrics in vehicular ad hoc networks (VANETs) and central to forwarding algorithms and the end-to-end delay. Due to ...
Hongzi Zhu, Luoyi Fu, Guangtao Xue, Yanmin Zhu, Mi...