A 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned col...
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with sensors located on the top plane, and inter-plane vias connecting these to other...
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...