Modern VLSI design methodologies and manufacturing technologies are making circuits increasingly fast. The quest for higher circuit performance and integration density stems from f...
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
The use of CMOS nanometer technologies at 65 nm and below will pose serious challenges on the design of mixed-signal integrated systems in the very near future. Rising design comp...
The next generation of computer chips will continue the trend for more complexity than their predecessors. Many of them will contain different chip technologies and are termed SoC...
Abstract - This paper describes a communicationcentric design methodology that addresses the fundamental challenges induced by the emergence of truly heterogeneous Systems-on-Chip ...
Radu Marculescu, Diana Marculescu, Larry T. Pilegg...