—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
Multi-Processor System-On-Chip (MPSoC) can provide the performance levels required by high-end embedded applications. However, they do so at the price of an increasing power densi...
Salvatore Carta, Andrea Acquaviva, Pablo Garcia De...
As feature sizes decrease, power dissipation and heat generation density exponentially increase. Thus, temperature gradients in Multiprocessor Systems on Chip (MPSoCs) can serious...
Fabrizio Mulas, Michele Pittau, Marco Buttu, Salva...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...