34 search results - page 1 / 7 » High Density Through Silicon Via (TSV) |
CORR
2008
Springer
13 years 4 months ago
2008
Springer
The Through Silicon Via (TSV) process developed by Silex provides down to 30
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
3DIC
2009
IEEE
13 years 12 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...