Sciweavers

Free Online Productivity Tools i2Speak i2Symbol i2OCR iTex2Img iWeb2Print iWeb2Shot i2Type iPdf2Split iPdf2Merge i2Bopomofo i2Arabic i2Style i2Image i2PDF iLatex2Rtf Sci2ools

6

CORR
2008
Springer

favoriteEmaildiscussreport

123views Education» more CORR 2008»

High Density Through Silicon Via (TSV)

13 years 3 months ago

High Density Through Silicon Via (TSV)

Download hal.archives-ouvertes.fr

The Through Silicon Via (TSV) process developed by Silex provides down to 30

Magnus Rimskog, Tomas Bauer

Real-time Traffic

CORR 2008 | Education | Mems | Wafer Connections | µm Pitch |

claim paper

Related Content

» 3Dintegration of silicon devices A key technology for sophisticated products

» Reliability aware through silicon via planning for 3D stacked ICs

» Exploring serial vertical interconnects for 3D ICs

» Compact modelling of ThroughSilicon Vias TSVs in threedimensional 3D integrated circuits

» Fabrication of 3D Packaging TSV using DRIE

» Design and feasibility of multiGbs quasiserial vertical interconnects based on TSVs for 3D...

» Through Silicon Vias as Enablers for 3D Systems

» Throughsiliconvia management during 3D physical design When to add and how many

» TSV stress aware timing analysis with applications to 3DIC layout optimization

Post Info
More Details (n/a)

Added	25 Dec 2010
Updated	25 Dec 2010
Type	Journal
Year	2008
Where	CORR
Authors	Magnus Rimskog, Tomas Bauer

Comments (0)