162 search results - page 2 / 33 » Interconnect Analysis: From 3-D Structures to Circuit Models |
ICCAD
2003
IEEE
14 years 2 months ago
2003
IEEE
Detailed electromagnetic analysis of three-dimensional structures in multilayered dielectric media is critical for automatic generation of equivalent circuit models for the interc...
ISQED
2010
IEEE
13 years 9 months ago
2010
IEEE
A simulation-based feasibility study of an intra-chip wireless interconnect system is presented. The wireless interconnect system is modelled in a 250 nm standard complementary met...
MICRO
2008
IEEE
13 years 11 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
ISLPED
2006
ACM
13 years 11 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
ICIAR
2004
Springer
13 years 10 months ago
2004
Springer
Abstract. We address the validation of the current sensed environmental state against a model known from earlier perception. Our surface based approach compares 3D range data of a ...