5 search results - page 1 / 1 » Multiple project wafers for medium-volume IC production |
ISCAS
2005
IEEE
13 years 10 months ago
2005
IEEE
—Multi-project wafer (MPW) is commonly used for low-volume IC production. In this paper, we study whether it can be used for medium-volume production. Cost equations are develope...
ISQED
2005
IEEE
13 years 10 months ago
2005
IEEE
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
- Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper1 , we propose a methodology to explore reticle floopla...
ISVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume pr...
DAC
1997
ACM
13 years 9 months ago
1997
ACM
A number of industry trends are shaping the requirements for IC and electronic equipment design. The density and complexity of circuit technologies have increased to a point where...