4 search results - page 1 / 1 » Novel wire density driven full-chip routing for CMP variatio... |
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
— As nanometer technology advances, the post-CMP dielectric thickness variation control becomes crucial for manufacturing closure. To improve CMP quality, dummy feature filling ...
ICCAD
2006
IEEE
14 years 1 months ago
2006
IEEE
In this paper, we propose the first wire density driven global routing that considers CMP variation and timing. To enable CMP awareness during global routing, we propose a compac...
TCAD
2008
13 years 4 months ago
2008
In this paper, we propose the first metal-density driven placement algorithm to reduce CMP variation and achieve higher routability. Based on an analytical placement framework, we...
ISVLSI
2007
IEEE
13 years 11 months ago
2007
IEEE
— Chemical-Mechanical Polishing (CMP) is one of the key steps during nanometer VLSI manufacturing process where minimum variation of layout pattern densities is desired. This pap...