6 search results - page 1 / 2 » Optical routing for 3D system-on-package |
GLVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
3DIC
2009
IEEE
13 years 8 months ago
2009
IEEE
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
DATE
2006
IEEE
13 years 11 months ago
2006
IEEE
Abstract— Optical interconnects enable faster signal propagation with virtually no crosstalk. In addition, wavelength division multiplexing allows a single waveguide to be shared...
DAC
2007
ACM
13 years 8 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
TPDS
1998
13 years 4 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...