3 search results - page 1 / 1 » Partition-driven standard cell thermal placement |
ICCAD
2003
IEEE
14 years 1 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
ISPD
2003
ACM
13 years 9 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
ISVLSI
2008
IEEE
13 years 11 months ago
2008
IEEE
In high-performance VLSI circuits, the on-chip power densities are playing dominant role due to increased scaling of technology, increasing number of components, frequency and ban...