15 search results - page 3 / 3 » Temperature aware task scheduling in MPSoCs |
TPDS
2010
13 years 3 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
TPDS
2008
13 years 5 months ago
2008
High Performance Computing data centers have been rapidly growing, both in number and size. Thermal management of data centers can address dominant problems associated with cooling...
TVLSI
2008
13 years 5 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
DAC
2011
ACM
12 years 5 months ago
2011
ACM
We study the problem on how to maximize the throughput for a periodic real-time system under the given peak temperature constraint. We assume that different tasks in our system ma...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Within-die variation in leakage power consumption is substantial and increasing for chip-level multiprocessors (CMPs) and multiprocessor systems-on-chip. Dealing with this problem...