26 search results - page 1 / 6 » Thermal via placement in 3D ICs |
ISPD
2005
ACM
13 years 10 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ICCD
2007
IEEE
14 years 2 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
ASPDAC
2007
ACM
13 years 9 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
ICCAD
2003
IEEE
14 years 2 months ago
2003
IEEE
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...