17 search results - page 1 / 4 » Yield Improvement, Fault-Tolerance to the Rescue |
IOLTS
2008
IEEE
13 years 12 months ago
2008
IEEE
With the technology entering the nano dimension, manufacturing processes are less and less reliable, thus drastically impacting the yield. A possible solution to alleviate this pr...
FPL
2005
Springer
13 years 11 months ago
2005
Springer
This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on proven yield models, this work improves the predictions and assumptions of previous...
FPL
2006
Springer
13 years 9 months ago
2006
Springer
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
ICCAD
2008
IEEE
14 years 2 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
ICCAD
2002
IEEE
14 years 2 months ago
2002
IEEE
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...