This paper presents a revised model for the yield analysis of FPGA interconnect layers. Based on proven yield models, this work improves the predictions and assumptions of previous...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
The high unit cost of FPGA devices often deters their use beyond the prototyping stage. Efforts have been made to reduce the part-cost of FPGA devices, resulting in the developmen...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
As manufacturing technology enters the ultra-deep submicron era, wafer yields are destined to drop due to higher occurrence of physical defects on the die. This paper proposes a y...
Nicola Campregher, Peter Y. K. Cheung, George A. C...
Future process nodes have such small feature sizes that there will be an increase in the number of manufacturing defects per die. For large FPGAs, it will be critical to tolerate ...
attributed to the high regularity of memories, PAs and FPGAs, and the ease with which they can be tested and reconfigured to avoid faulty elements. Digital microfluidicsbased bioch...