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ISQED
2006
IEEE
75views Hardware» more  ISQED 2006»
13 years 10 months ago
Interconnect and Thermal-aware Floorplanning for 3D Microprocessors
Interconnects are becoming an increasing problem from both performance and power consumption perspective in fu
Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vi...
IPPS
2006
IEEE
13 years 10 months ago
Performance evaluation of wormhole routed network processor-memory interconnects
Network line cards are experiencing ever increasing line rates, random data bursts, and limited space. Hence, they are more vulnerable than other processormemory environments, to ...
Taskin Koçak, Jacob Engel
DATE
2007
IEEE
96views Hardware» more  DATE 2007»
13 years 11 months ago
Self-heating-aware optimal wire sizing under Elmore delay model
Global interconnect temperature keeps rising in the current and future technologies due to self-heating and the adiabatic property of top metal layers. The thermal e ects impact a...
Min Ni, Seda Ogrenci Memik