254
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DAC
2011
ACM
14 years 7 months ago
2011
ACM
SystemC is a popular modeling language which can be used to specify systems at bstraction level. Currently, SystemC tools can not cope with SystemC models for which the module hie...
346
click to vote
DAC
2011
ACM
14 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
196
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DAC
2011
ACM
14 years 7 months ago
2011
ACM
Technology scaling allows the integration of billions of transistors on the same die but CAD tools struggle in keeping up with the increasing design complexity. Design productivit...
184
click to vote
DAC
2011
ACM
14 years 7 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
358
click to vote
DAC
2011
ACM
14 years 7 months ago
2011
ACM
In this paper, a new sparse approximation technique is proposed for incremental power grid analysis. Our proposed method is motivated by the observation that when a power grid net...