223
click to vote
DAC
2006
ACM
16 years 8 months ago
2006
ACM
The increasing use of Multiprocessor Systems-on-Chip (MPSoCs) for high performance demands of embedded applications results in high power dissipation. The memory subsystem is a la...
187
click to vote
DAC
2006
ACM
16 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...