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69

MR
2006

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High-temperature reliability of Flip Chip assemblies

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High-temperature reliability of Flip Chip assemblies

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T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf As

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Added	14 Dec 2010
Updated	14 Dec 2010
Type	Journal
Year	2006
Where	MR
Authors	T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl

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