4 search results - page 1 / 1 » High-temperature reliability of Flip Chip assemblies |
MR
2006
13 years 6 months ago
2006
Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...
MR
2006
13 years 6 months ago
2006
MR
2008
13 years 5 months ago
2008
The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies ...
MR
2002
13 years 5 months ago
2002
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...