Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
The interconnection architecture of FPGAs such as switches dominates performance of FPGAs. Three-dimensional integration of FPGAs overcomes interconnect limitations by allowing in...
Young-Su Kwon, Payam Lajevardi, Anantha P. Chandra...