150 search results - page 7 / 30 » Design and CAD for 3D integrated circuits |
ICCAD
2006
IEEE
15 years 6 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
ISPD
2005
ACM
15 years 3 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
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ISPD
2010
ACM
15 years 4 months ago
2010
ACM
Existing 3D placement techniques are mainly used for standardcell circuits, while mixed-size placement is needed to support highlevel functional units and intellectual property (I...
DAC
1998
ACM
15 years 10 months ago
1998
ACM
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...