111 search results - page 8 / 23 » IPR: An Integrated Placement and Routing Algorithm |
107
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DAC
2003
ACM
15 years 4 months ago
2003
ACM
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
ISPD
2005
ACM
15 years 5 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
FPGA
2003
ACM
15 years 4 months ago
2003
ACM
The routing channels of an FPGA consist of wire segments of various types providing the tradeoff between performance and routability. In the routing architectures of recently dev...
GLVLSI
2005
IEEE
15 years 5 months ago
2005
IEEE
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
108
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DAC
2007
ACM
16 years 18 days ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...