157 search results - page 31 / 32 » Performance area efficiency in chip multiprocessors with mic... |
BMCBI
2010
13 years 7 months ago
2010
Background: Solving bioinformatics tasks often requires extensive computational power. Recent trends in processor architecture combine multiple cores into a single chip to improve...
TECS
2008
13 years 7 months ago
2008
tion. Transaction Level Modeling (TLM) has been proposed to abstract communication for highspeed system simulation and rapid design space exploration. Although being widely accepte...
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
This paper proposes an efficient method to predict the worst case of voltage violation by multi-domain clock gating in a three-dimensional (3D) on-chip power network considering l...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...