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BMCBI
2010
218views more  BMCBI 2010»
13 years 4 months ago
Fast multi-core based multimodal registration of 2D cross-sections and 3D datasets
Background: Solving bioinformatics tasks often requires extensive computational power. Recent trends in processor architecture combine multiple cores into a single chip to improve...
Michael Scharfe, Rainer Pielot, Falk Schreiber
TECS
2008
122views more  TECS 2008»
13 years 4 months ago
Quantitative analysis of the speed/accuracy trade-off in transaction level modeling
tion. Transaction Level Modeling (TLM) has been proposed to abstract communication for highspeed system simulation and rapid design space exploration. Although being widely accepte...
Gunar Schirner, Rainer Dömer
ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
13 years 9 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
SLIP
2009
ACM
13 years 10 months ago
Predicting the worst-case voltage violation in a 3D power network
This paper proposes an efficient method to predict the worst case of voltage violation by multi-domain clock gating in a three-dimensional (3D) on-chip power network considering l...
Wanping Zhang, Wenjian Yu, Xiang Hu, Amirali Shaya...
ASPDAC
2006
ACM
148views Hardware» more  ASPDAC 2006»
13 years 8 months ago
TAPHS: thermal-aware unified physical-level and high-level synthesis
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
Zhenyu (Peter) Gu, Yonghong Yang, Jia Wang, Robert...