306 search results - page 28 / 62 » Power and cost aware distributed load management |
COMSWARE
2007
IEEE
15 years 6 months ago
2007
IEEE
Abstract— Minimizing the energy cost and improving thermal performance of power-limited datacenters, deploying large computing clusters, are the key issues towards optimizing the...
113
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SLIP
2009
ACM
15 years 6 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
TPDS
2008
14 years 11 months ago
2008
High Performance Computing data centers have been rapidly growing, both in number and size. Thermal management of data centers can address dominant problems associated with cooling...
104
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DASFAA
2009
IEEE
15 years 6 months ago
2009
IEEE
Abstract. Privacy becomes a major concern for both customers and enterprises in today’s corporate marketing strategies, many research efforts have been put into developing new p...
109
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DATE
2006
IEEE
15 years 5 months ago
2006
IEEE
With the advent of multi-processor systems-on-chip, the interest in process migration is again on the rise both in research and in product development. New challenges associated w...